DDR3 is the next-generation evolution of DDR2 and older DDR
memory technology that will break the Gigahertz speed barrier for memory speed.
DDR3 is an industry standard technology defined by JEDEC. JEDEC is the
semiconductor standardization body of the Electronic Industries Alliance (EIA).
About 300 member companies representing every segment of the industry actively
participate to develop standards to meet the industry needs. Kingston is a
long-time member of JEDEC and is active on the JEDEC Board of Directors as well
as a number of memory technology committees.
DDR3 memory features faster speeds, higher data bandwidths, lower voltage and
power consumption, and enhanced thermal performance. DDR3 memory is engineered
to support the next-generation quad-processors which require high data bandwidth
to enable higher levels of performance.
DDR3 available on desktops, servers, notebooks, telecommunications/networking
and other platforms in the following form-factors:
DDR3 memory modules come in 1066MHz, 1333MHz and 1600MHz speeds
- Unbuffered DIMMs, ECC or non-ECC
- Registered ECC DIMMs
- Custom Modules
DDR3 memory module components are show below (Unbuffered, Non-ECC DIMM for
DDR3 memory modules are not backward-compatible with DDR2 or DDR modules,
due to incompatible pin configurations, voltage, and DRAM memory chip
technology. DDR3 modules have a different "key" than DDR modules in the edge
connector to prevent insertion into incompatible memory sockets.
JEDEC standard modules
transfers per second
A system with dual-channel memory will deliver twice the peak
memory bandwidth listed above. For example, a PC3-8500 based system can deliver
a peak memory bandwidth of 2 x 8.5 GB/sec or 17 GB/sec.
A system with triple-channel memory will deliver three times the peak memory
bandwidth listed above. For example, a PC3-8500 based system can deliver a peak
memory bandwidth of 3 x 8.5 GB/sec or 25 GB/sec.